1FF
(Full size)
Size:
85.6mm x 53.98mm x 0.76mm
With dimensions similar to a credit card, this form factor is no longer used in modern devices. You are only likely to encounter it in legacy equipment.
Discover more about the differences between these form factors, and their suitability for various use cases.
In many use cases, an eSIM incorporates a type of software standard known as eUICC (Embedded Universal Integrated Circuit Card). This allows a single chip to host multiple SIM profiles. It also makes it possible to add, remove and manage these profiles over the air via a method called remote SIM provisioning (RSP). Note: usage of eUICC is not confined to Embedded SIM. You can deploy it with other SIM form factors, too.
Usage of the term eSIM can be variable in industry. Some use eSIM to simply mean Embedded SIM. Others, including Wireless Logic use eSIM to mean eUICC.
With dimensions similar to a credit card, this form factor is no longer used in modern devices. You are only likely to encounter it in legacy equipment.
Up until the introduction of 3FF and 4FF SIMs in 2010 and 2012 respectively, the mini-SIM was the industry-standard form factor for nearly a decade. Although its usage has now declined, it is still found in various devices; particularly larger industrial and commercial equipment (e.g. vending machines), and fleet tracking devices.
The Micro SIM first saw widespread use when it was incorporated in the original Apple iPad. Common applications include handheld industrial equipment, tablets and health monitors.
The Nano SIM is not only smaller but also thinner than its predecessors. The design also incorporates a rim around the contact area to prevent short-circuiting. The compact sizing makes these SIMs a popular choice for wearables and small portable devices.
This chip form factor is also known as Embedded SIM (eSIM).
If your plans involve a roll-out of IoT devices across a range or regions, an eSIM or eUICC SIM may be an attractive option. All devices can receive the same eSIM at the manufacturing stage, and devices can later be remotely provisioned with a relevant profile, depending on the market they are destined for. This approach can mean a quicker and less expensive project rollout.
As it’s soldered into the device, an eSIM design can help ensure the integrity of the chip. For the removable 2FF – 4FF form factors, you can also opt for industrial-grade SIMs. Typically, these can withstand temperatures of between -40C and +105C. They also have an extended lifecycle — up to 15 years in many cases.